Beijing’s “Chip” Flagship: The Innovation and Entrepreneurship Platform of the ZGC IC Design Park was Released


On June 13, the ZGC IC Design Park held a launch conference for the innovation and entrepreneurship platform of the ZGC IC Design Park (hereafter referred to as “Launch Conference”), with the theme of “Constructing a frontier economic structure, Creating a ‘chip’ flagship”, at the exhibition center of Zhongguancun National Independent Innovation Demonstration Zone.

As an integral part of the construction of the economic structure that is suitable for cutting-edge technology in Beijing, the Park covers an area of 60,000 square meters, with a total construction area of 220,000 square meters and a green rate of 25%. Consisting of 16 R&D office building, the Park will accommodate 150 enterprises after completion, including 5-8 large international companies, with an annual output value of about 30 billion yuan.

The IC Design Park has been following the principle of “high-standard, professional and intelligent” from the beginning of the planning. According to the plan, it is to create a “Pan-IC Design Park”, centering around IC design, clustering upstream and downstream enterprises of IC industry, forming an integrated industrial chain, and extending to software application, smart hardware, Internet, Internet of Things and etc.  

It opens to global IC enterprises, aiming to create “four ecological circles”: the industrial ecological circle, the human-centered ecological circle, the enterprise ecological circle and intelligent ecological circle. According to the needs of IC design enterprises, it will provide “a service platform with eight industrial functions”, i.e. investment and financing, generic technology, talent training, innovation incubation, market promotion, overseas development, intermediary services and life supporting services.  It will focus on both common and individual problems of IC enterprises, helping them achieve rapid growth, thus creating a development space in the whole life cycle of them.

Later, a grand signing ceremony was held at the conference. The ZGC IC Design Park signed cooperation agreements with more than 20 institutions and enterprises, including Peking University, Tsinghua University, Chinese Academy of Sciences and other National Demonstration Microelectronics Colleges located in Beijing. It also signed agreements with China Semiconductor Association, American Semiconductor Association (China) among other associations and funds, as well as ZGC Sci-tech Entrepreneurship Financial Service Group, ZGC Sci-tech Financing and Guarantee Company and etc. 




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